Bert Thin Films, LLC has been awarded a $500K grant from the DuraMAT Consortium. The project solidifies the team with expertise from the National Lab and University researchers.
The industry has been very interested in replacing Ag with lower cost and abundant Cu but has resisted primarily on the potential accelerated degradation including copper diffusion into silicone, oxidation, and ethylene vinyl acetate reaction. This project aims to develop accelerated aging tests that explore the impact of diffusion, oxidation, and encapsulant degradation mechanisms.
“We are excited to add team members from the National Renewable Energy Laboratory and Georgia Institute of Technology to this important work” says Thad Druffel the founder and CEO of Bert Thin Films, LLC.
Read article at The Durable Module Materials (DuraMAT) Consortium: Durability of Modules Utilizing Screen-Printed Copper Contacts